How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process.
May 10, 2023
A solder ball is the most common type of defect that occurs in the SMT assembly process. Solder balls located within 0.13mm of traces
A solder ball is the most common type of defect that occurs in the SMT assembly process. Solder balls located within 0.13mm of traces
In SMT PCB production, solder paste printing is a critical step. Since the solder paste is used to directly form the soldering joint, the quality
In today’s rapidly advancing technological landscape, Surface Mount Technology (SMT) PCB assembly holds great significance when it comes to modern electronics manufacturing. SMT PCB assembly
The importance of testing in PCB manufacturing cannot be overstated. With PCBs being used for mission critical operations, the integrity & smooth functioning of the PCB is
Prioritizing quality and speed is important when choosing reliable Printed Circuit Board (PCB) and PCB assembly (PCBA) services. When it comes to this, the seasoned
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